Ein Referenzwerk von Autoren aus Wissenschaft und Forschung mit engen Verbindungen zur Industrie vereint Aspekte der Material- und Computerwissenschaften und des Engineering zu einem einheitlichen Blick auf vielversprechende Ansätze für materialintegrierte intelligente Systeme.

Stefan Bosse studied physics at the University of Bremen, Germany, from which he also received his PhD. Since 2008 he is actively involved in different projects in the University of Bremen's Scientific Center ISIS (Integrated Solutions in Sensorial Structure Engineering) pushing interdisciplinary research, and recently joined the ISIS council. Dirk Lehmhus joined the Fraunhofer Institute for Manufacturing Technology and Advanced Materials (IFAM) in Bremen, Germany, in 1998 and subsequently obtained a PhD in production technology from Bremen University for optimization studies of aluminium foam production processes and properties. Since May 2009 he is Managing Director at the University of Bremen's Scientific Centre ISIS dedicated to the development of sensorial materials and sensor-equipped structures. Walter Lang joined the Fraunhofer Institute for Solid State Technology (EMFT) in Munich, Germany, in 1987 where he worked on microsystems technology. In 1995, he became Head of the Sensors Department in the Institute of Micromachining and Information Technology of the Hahn Schickard Society. In 2003, he joined the University of Bremen where he is currently heading the Institute for Microsensors, -actuators and -systems at the Microsystems Center Bremen. Matthias Busse holds the chair for near net-shape manufacturing technology in the Faculty of Production Engineering at the University of Bremen since 2003. At the same time, he became Director of the Fraunhofer IFAM. After his PhD in mechanical engineering he worked in various positions at Volkswagen Central Research, ultimately as Head of Production Research. Matthias Busse represents the University of Bremen's Scientific Centre ISIS as speaker of the board of directors.

Leseprobe

SENSOR AND ELECTRONICS DEVELOPMENT FOR MATERIAL INTEGRATION Function Scale Integration - The Concept of Limiting Wounds to Materials Induced by Sensor Integration Development of New Types of Sensors Specifically Addressing Host Material Integration Aspects Compliant Sensor and Electronics Technology Techniques for Integrating Sensors with Materials: Bulk and Surface Integration INTERFACING TECHNOLOGIES Electrical and Optical Connectivity Bonding Techniques Printing Techniques for Interfacing Structures RELIABLE DATA PROCESSING PROVIDING ROBUSTNESS AI Methods for Data Evaluation Networking with Distributed Data Processing Sensor Signal Processing: Sensor Data Fusion RELIABLE COMMUNICATION PROVIDING ROBUSTNESS Communication Protocols on Link and Application Layer: Hard- and Software Side Communication on Physical Layer: Hardware Side, Physical Realization ENERGY SUPPLY Distribution, Management, Harvesting and Storage of Energy Low-Power Electronics for Signal and Data Processing APPLICATIONS Smart Skin Structural Health Monitoring Body Area Networks Smart Textiles Casttronics Metacomposites Programming